A Niche Technology Became a Choke Point for A.I

(nytimes.com)

3 points | by thinkcontext 6 hours ago ago

1 comments

  • gorgmah 5 hours ago

    >The packaging bottleneck has become a hot topic in Silicon Valley as TSMC has struggled to keep up with demand. Dr. Iyer tried to help by developing plans for a packaging research and development center, funded with $1.1 billion from the Biden administration and slated to be built in Arizona, but the Trump administration effectively killed the effort last year.

    Crazy how dependent on politics these projects are.